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Item #:
174474868
3D Integration for VLSI Systems
Item #:
174474868
XCD 356
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3D integration is identified as a possible avenue for continuous performance growth in integrated circuits.
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Product Details
- Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
| Publisher | Jenny Stanford Publishing |
| Publication date | April 19, 2016 |
| Edition | 1st |
| Language | English |
| File size | 28.2 MB |
| Enhanced typesetting | Not Enabled |
| X-Ray | Not Enabled |
| Word Wise | Not Enabled |
| Print length | 378 pages |
| Format | Print Replica |
| ISBN-13 | 978-9814303828 |
| Page Flip | Not Enabled |
| Item Weight | 1 lbs (450 grams) |
Product Description
3D Integration for VLSI Systems
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XCD 356
This product is not Fulfilled by Ubuy and can take minimum 10 days in delivery. We might cancel the product from the order and refund you if any issue arise with the delivery of this product.
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Features & Benefits
- Revolutionize your integrated circuits with 3D integration.
- Experience unprecedented performance growth.
- Enhance form factor and density multiplication.
- Improve power and delay characteristics.
- Achieve superior bandwidth and heterogeneous integration.
- Benefit from contributions by key researchers in the field.
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